一种2.5 V 1-MS/s 12位逐次逼近A/D转换器

设计了一种低功耗、中速中精度的单端输入逐次逼近A/D转换器,用于微处理器外围接口。其D/A转换器采用分段电容阵列结构,有利于版图匹配,节省了芯片面积;比较器使用三级前置放大器加锁存器的多级结构,应用了失调校准技术;控制电路协调模拟电路完成逐次逼近的工作过程,并且可以控制整个芯片进入下电模式。整个芯片使用UMC 0.18μm混合模式CMOS工艺设计制造,芯片面积1 400μm×1 030μm。仿真结果显示,设计的逐次逼近A/D转换器可以在2.5 V电压下达到12位精度和1 MS/s采样速率,模拟部分功耗仅为1 mW。     

用于射频系统的10 MS/s 10位SAR A/D转换器

设计了一种用于射频系统的低功耗、中速中精度差分输入逐次逼近型(SAR)A/D转换器。采样完成后采用下极板对接的逻辑算法,10位SAR A/D转换器只需9位DAC即可满足其精度要求。DAC阵列采用分段电容结构,节省了芯片面积。比较器采用前置运算放大器加锁存器的结构,达到了同时兼顾速度和精度的要求。该A/D转换器芯片采用GSMC 0.13 μm 1P7M CMOS工艺制造,其核心电路尺寸为500 μm×360 μm,采用1.2 V的单电源供电。测试结果表明,当采样频率为10 MS/s,输入信号频率为2 MHz时,该SAR A/D转换器达到8.45位的有效精度,总功耗为2.17 mW;当采样频率为5 MS/s,输入信号频率为1 MHz时,该SAR A/D转换器达到8.75位的有效精度,总功耗为2.07 mW。     

10位逐次逼近型A/D转换器的芯片设计

介绍了一种10位、3M sample/s逐次逼近型A/D转换器的设计,描述了具有可变时钟电路结构的有效工作方式.该模数转换器在0.6 μ m双多晶硅、双金属层CMOS工艺上实现,芯片总面积为3.2mm2.转换器采用单5V电源供电,功耗仅为3 5mW.     

一种10位80 Ms/s逐次逼近A/D转换器

基于65 nm CMOS工艺,设计了一种10位80 Ms/s的逐次逼近A/D转换器。该A/D转换器采用1.2 V电源供电以及差分输入、拆分单调的DAC网络结构。采用拆分单调的电容阵列DAC,可以有效降低A/D转换所消耗的能量,缩短DAC的建立时间,降低控制逻辑的复杂度,提高转换速度;避免了由于比较器共模电平下降过多引起的比较器失调,从而降低了比较器的设计难度,改善了ADC的线性度。动态比较器降低了A/D转换的功耗。使用Spectre进行仿真验证,结果表明,当采样频率为80 MHz,输入信号频率为40 MHz时,该A/D转换器的SFDR为72 dBc。     

一种基于0.13m CMOS工艺的10位SAR A/D转换器

基于SMIC0.13μm CMOS1P6M Logic工艺,采用一种新型R-C组合式D/A转换结构、伪差分比较结构以及低功耗电平转换结构设计了一种用于多电源SoC的10位8通道逐次逼近型A/D转换器。在3.3V模拟电源电压和1.2V数字电源电压下,测得DNL和INL分别为0.31LSB和0.63LSB。当采样频率为1MS/s,输入信号频率为490kHz时,测得的SFDR为67.33dB,ENOB为9.48bits,功耗为3.25mW。该A/D转换器版图面积为318μm×270μm,能直接应用于嵌入式多电源SoC。     

一种10位10 MS/s自补偿SAR A/D转换器

基于SMIC 0.18 μm CMOS工艺,设计了一种10位自补偿逐次逼近(SAR)A/D转换器芯片。采用5+5分段式结构,将电容阵列分成高5位和低5位;采用额外添加补偿电容的方法,对电容阵列进行补偿,以提高电容之间的匹配。采用线性开关,以提高采样速率,降低功耗。版图布局中,使用了一种匹配性能较好的电容阵列,以提高整体芯片的对称性,降低寄生参数的影响。在输入信号频率为0.956 2 MHz,时钟频率为125 MHz的条件下进行后仿真,该A/D转换器的信号噪声失真比(SNDR)为61.230 8 dB,无杂散动态范围(SFDR)达到75.220 4 dB,有效位数(ENOB)达到9.87位。     

一种轨至轨10位逐次逼近模数转换器的设计

设计了一款用于汽车电子MCU的轨至轨10位逐次逼近A/D转换器。采用单电容采样的DAC结构,保证A/D转换器的全摆幅输入范围。在后仿真验证中,采用频谱分析方法,标定寄生电容对DAC精度的影响,优化了版图结构。设计了片内低压差线性稳压器,提供稳定的电源电压信号。芯片采用GSMC 0.18μm 1P6M CMOS工艺实现。后仿真结果表明,在1.8V电源电压、51kHz输入信号频率、1MHz时钟频率下,无杂散动态范围(SFDR)为73.596dB,有效位数(ENOB)达到9.78位,整体功耗2.24mW,满足汽车电子MCU的应用需求。     

16位逐次逼近A/D转换器熔丝误差修调技术

提出了一种提高16位逐次逼近(SAR)A/D转换器精度的熔丝误差修调技术。该技术用于提高A/D转换器内部核心模块—16位DAC的精度,从而达到提高整个A/D转换器精度的目的。电路采用标准CMOS工艺流片。测试结果显示,熔丝误差修调后,常温下,电路的INL为2.5 LSB,SNR为88.8 dB,零点误差EZ为1.1 LSB;修调后,A/D转换器有效位数ENOB从12.56位提高到14.46位。     

一种基于90nm工艺的10位电荷再分配型逐次逼近模数转换器IP

在比较了三种不同的分段式全电容D/A结构的基础上,介绍了一种10 bit电荷再分配型逐次逼近A/D转换器IP的设计.该转换器采用UMC 90 nm SP-RVT CMOS工艺.该转换器IP的特点是采用了一种利用边缘效应的边缘电容器来代替代价昂贵的PIP和MIM电容器,提高了该IP的工艺兼容性,降低了成本.后仿真结果显示,此A/D转换器在1 Msam-ple/S的速度下,有效位数可达9.6 bit,功耗仅为500μW.     

一种10位50MS/s两级逐次逼近流水线混合型A/D转换器

本文在0.18μm CMOS工艺下,实现了一款10位50MS/s两级逐次逼近流水线混合型模数转换器（pipeline SAR ADC）。其由基于逐次逼近的增益模数单元和逐次逼近ADC组成,并采用1位冗余位放宽了子模数转换器的比较误差。通过采用逐次逼近结构,增益减半MDAC技术,动态比较器及动态逐次逼近控制逻辑,降低了模数转换器的功耗和面积。流片测试结果表明,在1.8V电源电压,50MS/s采样速率下,信噪失真比(SFDR)和功耗分别为56.04dB和5mV。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.