脉冲ArF准分子激光淀积SiC/Si(100)薄膜的最佳晶化温度及光致发光

用脉冲 Ar F准分子激光熔蚀 Si C陶瓷靶 ,在 80 0℃ Si(10 0 )衬底上淀积 Si C薄膜 ,经不同温度真空 (10 - 3Pa)退火后 ,用 FTIR、XRD、TEM、XPS、PL 谱等分析方法 ,研究了薄膜最佳晶化温度及表面形态、结构、组成 ,并对在最佳退火温度处理后的样品进行了化学态、微结构及光致发光的研究 .结果表明 ,在 Si(10 0 )上 80 0℃淀积的样品为非晶Si C薄膜 .经 85 0— 10 5 0℃不同温度真空退火后 ,Si C薄膜经非晶核化 -长大过程 ,在 980℃完成最佳晶化 .随退火温度的变化 ,薄膜中可能存在 3C- Si C与 6 H- Si C的竞争生长或 /和 3C- Si C相的长、消 (最佳温度     

PLD法制备ZnO薄膜的退火特性和蓝光机制研究

通过脉冲激光沉积(PLD)方法,在O2中和100～500℃衬底温度下,用粉末靶在Si(111)衬底上制备了ZnO薄膜,在300℃温度下生长的薄膜在400～800℃温度和N2氛围中进行了退火处理,用X射线衍射(XRD)谱、原子力显微镜(AFM)和光致发光(PL)谱表征薄膜的结构和光学特性。XRD谱显示,在生长温度300℃时获得较好的复晶薄膜,在退火温度700℃时获得最好的六方结构的结晶薄膜;AFM显示,在此退火条件下,薄膜表面平整、晶粒均匀;PL谱结果显示,在700℃退火时有最好的光学特性。     

脉冲ArF准分子激光淀积SiC/Si(100)薄膜的最佳晶化温度及光致发光

用脉冲ArF准分子激光熔蚀SiC陶瓷靶,在800C Si(100)衬底上淀积SiC薄膜,经不同温度真空(10-3Pa)退火后,用FTIR、XRD、TEM、XPS、PL谱等分析方法,研究了薄膜最佳晶化温度及表面形态、结构、组成,并对在最佳退火温度处理后的样品进行了化学态、微结构及光致发光的研究.结果表明,在Si(100)上800C淀积的样品为非晶SiC薄膜.经850-1050C不同温度真空退火后,SiC薄膜经非晶核化-长大过程,在980C完成最佳晶化.随退火温度的变化,薄膜中可能存在3C-SiC与6H-SiC的竞争生长或/和3C-SiC相的长、消(最佳温度退火样品中6H-SiC和3C-SiC两种晶相共存).以370nm波长光激发样品薄膜表面,显示较强的447nm蓝光发射,其发光机制可能是空位缺陷及其它晶格缺陷形成的浅施主能级向价带的电子辐射复合跃迁.     

掺铒Al_2O_3/Si多层薄膜中纳米晶Si的形成和敏化效应

采用脉冲激光沉积制备了掺铒Al2O3/Si多层薄膜,在淀积过程中脉冲激光溅射产生的高能量Er原子渗透进入非晶硅层,并引入了额外的应力,在低退火温度下诱导形成纳米晶Si。利用纳米晶Si作为敏化剂有效地增强了Er3+在Al2O3中的光致发光。样品微观结构和发光强度的关系表明,获得高密度和小尺寸的纳米晶Si和Er3+处于良好的发光环境是实现优化发光的关键,最优化的Er3+发光强度在退火温度为600℃的条件下得到。     

激光脉冲频率对纳米Si晶薄膜形貌的影响

在气压为10 Pa的惰性气体Ar环境下,采用XeCl准分子激光器(波长308 nm),调整激光单脉冲能量密度为4 J/cm2,激光烧蚀电阻率为3000Ω.cm的高纯单晶Si靶,在玻璃或Si衬底上沉积制备了纳米Si晶薄膜。实验中靶和衬底间距离保持为3 cm,对衬底既没有加温也没有冷却。拉曼(Raman)谱测量结果表明,所制备的薄膜中已有纳米Si晶粒形成。保持脉冲总数不变,分别取激光脉冲频率为1 Hz,3 Hz,10 Hz和20 Hz,相应沉积时间约为10 min,3.3 min,1 min和0.5 min,采用扫描电子显微镜(SEM)观察所得样品的表面形貌,不同脉冲频率下的结果比较显示,脉冲频率越大,制备的纳米Si晶薄膜的平均晶粒尺寸就越小,晶粒尺寸分布也越均匀。沉积动力学过程的非线性是导致实验出现该结果的原因。     

溶胶-凝胶法制备钡钕钛薄膜及其介电性能研究

采用溶胶-凝胶法在Si(111)和Pt/Ti/SiO2/Si衬底上制备Ba4Nd9.33Ti18O54(BNT)介质薄膜,采用X线衍射仪(XRD)和扫描电子显微镜(SEM)研究了不同退火温度对薄膜结构和表面形貌的影响。结果表明当薄膜在950℃下退火2h后具有较好结晶质量的钨青铜结构,所得到的薄膜表面较为疏松;通过掺入质量分数为2%B2O3-2SiO2,可进一步将BNT薄膜的晶化温度降至900℃,且结构致密。介电性能测试表明,1 MHz频率下BNST薄膜的介电常数为45,介电损耗为1.1%,30V偏压下漏电流密度为4.13×10-6 A/cm2。     

PECVD制备纳米晶多晶硅薄膜

以Si(100)为衬底,采用磁控溅射和射频等离子体增强化学气相沉积系统制备了Si(100)/Al膜/非晶Si膜结构的样品。对该样品进行Al诱导真空退火以制备多晶硅薄膜,采用X射线衍射仪(XRD)和AFM分析薄膜微结构及表面形貌。实验结果表明,在经过500℃、550℃Al诱导退火后,形成了择优取向为〈111〉晶向的多晶硅薄膜。AFM给出了550℃退火后薄膜表面形貌,为100～200nm大小的圆丘状硅晶粒,密集排列在薄膜表面;并对Al诱导真空退火晶化的机理进行了分析。     

原位XPS分析Al2O3作为势垒层的Er2O3/Si结构

在超高真空条件下,通过脉冲激光沉积(PLD)技术制作了Er2O3/Al2O3/Si多层薄膜结构,原位条件下利用X射线光电子能谱(XPS)研究了Al2O3作为势垒层的Er2O3与Si界面的电子结构.XPS结果表明,Al2O3中Al的2p芯能级峰在低、高温退火前后没有变化;Er的4d芯能级峰来自于硅酸铒中的铒,并非全是本征氧化铒薄膜中的铒;衬底硅的芯能级峰在沉积Al2O 3时没有变化,说明Al2O3薄膜从沉积到退火不参与任何反应,与Si界面很稳定;在沉积Er2O3薄膜和退火过程中,有硅化物生成,表明Er2O3与Si的界面不太稳定,但随着Al2O3薄膜厚度的增加,其硅化物中硅的峰强减弱,含量减少,说明势垒层很好地起到了阻挡扩散的作用.     

退火温度和退火时间对不同衬底上Mg_(2)Si薄膜结构的影响北大核心CSCD

以Mg_(2)Si烧结靶为靶材,采用磁控溅射法在Si、石英和Al_(2)O_(3)衬底上先沉积一层Mg_(2)Si非晶薄膜,再进行退火处理,研究了衬底类型、退火温度及退火时间对Mg_(2)Si多晶薄膜结构的影响。结果表明:Si、石英、Al_(2)O_(3)三种衬底上Mg_(2)Si薄膜的最优退火温度和退火时间均为350◦C和1 h。Al_(2)O_(3)衬底上的Mg_(2)Si薄膜结晶质量最佳,Si衬底上的薄膜次之,石英衬底上的薄膜结晶质量最不理想,分析表明这种差异主要源于衬底与薄膜之间的热失配不同。     

激光脉冲频率对不同衬底上非晶硅薄膜晶化的影响

应用不同频率的YAG激光分别对单晶硅及多晶硅衬底上的非晶硅薄膜进行了退火处理。晶化后的非晶硅薄膜的物相结构和表面形貌用XRD和AFM进行分析。XRD测试结果表明:随着激光频率的增加,两种衬底上的非晶硅薄膜晶化晶粒尺寸均出现了先增加后降低的现象。所有非晶硅样品的衍射峰位与衬底一致,说明非晶硅薄膜的晶粒生长是外延生长。从多晶硅衬底样品的XRD可以看出,随着激光频率的增加,激光首先融化衬底表面,然后衬底表层与非晶硅薄膜一起晶化。非晶硅薄膜最佳晶化激光频率分别为:多晶硅衬底20Hz,单晶硅衬底10Hz。     

高掺铒硅基氧化钽脊形光波导

首次提出了采用Er-Ta共溅、高温退火的方法,在硅基二氧化硅表面制备高掺铒氧化钽（Er:Ta2O5）薄膜。利用棱镜耦合仪分析了铒掺杂浓度对Er:Ta2O5薄膜的折射率的影响,结果表明:Er:Ta2O5薄膜的折射率随着Er掺杂浓度的增加而略微降低,且所制备的薄膜没有明显的各向异性。在此基础上,成功制备出Er掺杂浓度分别为0、2.5、5、7.5 mol%的硅基Er:Ta2O5脊形波导,波导在1 550 nm波段可实现单模传输,通过截断法得到波导在1 600 nm波长处的传输损耗分别为0.6、1.1、2.5、5.0 dB/cm。在所制备的Er:Ta2O5薄膜中,尽管没有发现Er2O3结晶析出,但薄膜中的Er3+会影响Ta2O5晶体的结晶程度,进而增加波导的传输损耗。最终文中制备的掺杂浓度为2.5 mol%的硅基Er:Ta2O5脊形波导通过980 nm激光泵浦,在1 531 nm信号波长下达到了3.1 dB/cm的净增益。     

The influence of local surroundings of Er atoms on the kinetics of decay of Er photoluminescence in amorphous hydrogenated silicon

Kinetics of the decay of photoluminescence of Er impurity in the films of amorphous hydrogenated Si a-Si:H〈Er〉 was studied for the first time. The films were obtained either by cosputtering of Si and Er targets with the use of the technology of dc silane decomposition in a magnetic field (MASD) or by radio-frequency decomposition of silane. In the second case, an Er(TMHD)₃ polymer powder was used as the source of Er. It is shown that, at room temperature, the a-Si:H〈Er〉 films obtained by the MASD method feature the characteristic times of Er photoluminescence decay equal to 10–15 μs, which is 20 times smaller than in the case of Er-doped crystalline Si (c-Si〈Er, O〉) as measured at liquid-nitrogen temperature. For the a-Si:H〈Er〉 films obtained by radio-frequency decomposition of silane, the decay times of Er photoluminescence amount to 2 μs. The difference in the photoluminescence decay times is related to dissimilarities in the local surroundings of Er atoms in the a-Si:H〈Er〉 films obtained by different methods. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 34, No. 1, 2000, pp. 90–92. Original Russian Text Copyright ? 2000 by Terukov, Kudoyarova, Kon’kov, Konstantinova, Kamenev, Timoshenko.     

金属诱导非晶硅薄膜低温晶化

介绍了一种非晶硅 (a- Si)薄膜低温晶化的新工艺 :金属诱导非晶硅薄膜低温晶化。研究了各种 a- Si/金属双层膜退火后的晶化情况。利用 X射线衍射分析了结晶硅膜的结构 ,通过光学显微镜观察了 Al诱导 a- Si薄膜晶化后的表面形貌 ,并初步探讨了金属诱导非晶硅薄膜低温晶化的机理     

SiO_2:Er和Si_xO_2:Er薄膜室温Er~(3+)1.54μm波长的电致发光

在 n+ -Si衬底上用磁控溅射淀积掺 Er氧化硅 (Si O2 :Er)薄膜和掺 Er富硅氧化硅 (Six O2 :Er,x>1 )薄膜 ,薄膜经适当温度退火后 ,蒸上电极 ,形成发光二极管 (LED)。室温下在大于 4V反偏电压下发射了来自 Er3+的 1 .5 4μm波长的红外光。测量了由 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品分别制成的两种 LED,其 Er3+1 .5 4μm波长的电致发光峰强度 ,后者明显比前者强。还发现电致发光强度与 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品的退火温度有一定依赖关系     

Design and fabrication of integrated Si-based optoelectronic devices

We have designed and fabricated novel Si-based optoelectronic devices. To this aim, different Si-based optical sources have been made and their performances at room temperature compared. Er-doped Si p–n junctions, operating at 1.54 μm and exhibiting an efficiency of 0.05% at room temperature, have been integrated with planar Si rib waveguides using either epitaxial Si or silicon on insulators (SOI) wafers. Optical characterization of these waveguides reveals very low transmission losses (below 1 dB/cm). However, Er-doping of the waveguide core, needed for the realization of the light source, results in a large increase of the losses as a consequence of absorption by the free electrons introduced by the rare earths. These losses can be suppressed when the junction is reverse biased and the whole Er profile is embodied in the depletion layer. Since this also allows efficient pumping of Er ions by hot carriers, the performances of the diodes and of the waveguides can be suitably combined. This optimized structure has also been used to design electrically pumped optical amplifiers and lasers, whose performances have been simulated.     

退火温度对ZnS/PS薄膜的晶体结构和光电性质的影响

用脉冲激光沉积法(PLD)在多孔硅(PS)衬底上生长ZnS薄膜,分别在300℃、400℃和500℃下真空退火。用X射线衍射(XRD)和扫描电子显微镜(SEM)研究了退火对ZnS薄膜的晶体结构和表面形貌的影响,并测量了ZnS/PS复合体系的光致发光(PL)谱和异质结的I-V特性曲线。研究表明,ZnS薄膜仅在28.5°附近存在着(111)方向的高度取向生长,由此判断薄膜是单晶立方结构的-βZnS。随着退火温度的升高,-βZnS的(111)衍射峰强度逐渐增大,且ZnS薄膜表面变得更加均匀致密,说明高温退火可以有效地促进晶粒的结合并改善结晶质量。ZnS/PS复合体系的PL谱中,随着退火温度升高,ZnS薄膜的自激活发光强度增大,而PS的发光强度减小,说明退火处理更有利于ZnS薄膜的发光。根据三基色叠加的原理,ZnS的蓝、绿光与PS的红光相叠加,ZnS/PS体系可以发射出较强的白光。但过高的退火温度会影响整个ZnS/PS体系的白光发射。ZnS/PS异质结的I-V特性曲线呈现出整流特性,且随着退火温度的升高其正向电流增加。     

Influence of oxygen on the photoluminescence intensity of erbium (at 1.54 µm) in erbium-doped a-Si:H films

The influence of oxygen on the photoluminescence (PL) of erbium (at 1.54 μm) in erbium-doped hydrogenated amorphous silicon (c-Si〈Er〉) is investigated. The a-Si:H〈Er〉 films studied are fabricated by cosputtering Si and Er targets using the technology of dc silane decomposition in a magnetic field. The oxygen concentration is varied from 10¹⁹ to 10²¹ cm⁻³ by increasing the partial pressure of oxygen in the chamber. It is shown that, as in the case of erbium-doped crystalline silicon (c-Si〈Er〉), oxygen has an effect on the intensity of the 1.54 μm photoluminescence in a-Si:H〈Er〉 films. The values of the erbium and oxygen concentrations at which the maximum Er PL intensity is observed are two orders of magnitude higher than in crystalline silicon. The increase in the Er PL intensity at room temperature and the weaker temperature dependence of the Er PL in comparison to c-Si〈Er,O〉 attest to the prospect of using a-Si:H〈Er〉 films in optoelectronic applications. Fiz. Tekh. Poluprovodn. 32, 1384–1389 (November 1998)     

Characteristics and device applications of erbium doped III-V semiconductors grown by molecular beam epitaxy

We have studied the properties of molecular beam epitaxially (MBE)-grown Erdoped III-V semiconductors for optoelectronic applications. Optically excited Er³⁺ in insulating materials exhibits optical emission chiefly around 1.54 μm, in the range of minimum loss in silica fiber. It was thought, therefore, that an electrically pumped Er-doped semiconductor laser would find great applicability in fiber-optic communication systems. Exhaustive photoluminescence (PL) characterization was conducted on several of As-based III-V semiconductors doped with Er, on bulk as well as quantum-well structures. We did not observe any Errelated PL emission at 1.54 μm for any of the materials/structures studied, a phenomenon which renders impractical the realization of an Er-doped III-V semiconductor laser. Deep level transient spectroscopy studies were performed on GaAs and AlGaAs co-doped with Er and Si to investigate the presence of any Er-related deep levels. The lack of band-edge luminescence in the GaAs:Er films led us to perform carrier-lifetime measurements by electro-optic sampling of photoconductive transients generated in these films. We discovered lifetimes in the picosecond regime, tunable by varying the Er concentration in the films. We also found the films to be highly resistive, the resistivity increasing with increasing Er-concentration. Intensive structural characterization (double-crys-tal x-ray and transmission electron microscopy) performed by us on GaAs:Er epilayers indicates the presence of high-density nanometer-sized ErAs precipitates in MBE-grown GaAs:Er. These metallic nanoprecipitates probably form internal Schottky barriers within the GaAs matrix, which give rise to Shockley-Read-Hall recombination centers, thus accounting for both the high resistivities and the ultrashort carrier lifetimes. Optoelectronic devices fabricated included novel tunable (in terms of speed and responsivity) high-speed metal-semiconductor-metal (MSM) photodiodes made with GaAs:Er. Pseudomorphic AlGaAs/ InGaAs modulation doped field effect transistors (MODFETs) (for high-speed MSM-FET monolithically integrated optical photoreceivers) were also fabricated using a GaAs:Er buffer layer which substantially reduced backgating effects in these devices.