共查询到19条相似文献,搜索用时 125 毫秒
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用p型有机半导体材料酞菁铜作为阴极缓冲层制作了器件结构为氧化铟锡/酞菁锌/碳六十/酞菁铜/铝的有机小分子太阳能电池, 对器件进行电学测量发现酞菁铜缓冲层的厚度对器件的开路电压有明显影响.基于半导体器件物理分析了光照下测量得到的电流-电压曲线, 由拟合结果得到的器件参数表明高理想因子导致了器件开路电压升高, 其原因为器件的输运特性不只受酞菁锌与碳六十形成的p-n结影响, 还与酞菁铜缓冲层与铝电极形成的肖特基接触有关.研究表明在有机太阳能电池器件中引入一个合适的缓冲层/阴极肖特基结可以提高器件的开路电压. 相似文献
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《红外与毫米波学报》2015,(4)
用p型有机半导体材料酞菁铜作为阴极缓冲层制作了器件结构为氧化铟锡/酞菁锌/碳六十/酞菁铜/铝的有机小分子太阳能电池,对器件进行电学测量发现酞菁铜缓冲层的厚度对器件的开路电压有明显影响.基于半导体器件物理分析了光照下测量得到的电流-电压曲线,由拟合结果得到的器件参数表明高理想因子导致了器件开路电压升高,其原因为器件的输运特性不只受酞菁锌与碳六十形成的p-n结影响,还与酞菁铜缓冲层与铝电极形成的肖特基接触有关.研究表明在有机太阳能电池器件中引入一个合适的缓冲层/阴极肖特基结可以提高器件的开路电压. 相似文献
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提出了一种用来提高短沟道MOS管性能的非对称内表面氧化层结构。该结构是在MOS管的源端附近生长一层厚的内表面氧化层,以抑制载流子迁移率的降低,同时,在MOS管的漏端附近生长一层薄的内表面氧化层,以抑制器件的短沟道效应。使用TCAD软件进行仿真和分析,结果显示,与对称内表面氧化层结构相比,非对称内表面氧化层结构具有更好的导通-关断特性。对器件进行优化,当源端较厚的内表面氧化层占总氧化层的比例为15%左右时,器件的性能得到最大幅度的提高。在相同的关断电流下,与对称内表面氧化层器件相比,非对称内表面氧化层器件的导通电流提高5%~15%。 相似文献
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提出了一种用来提高短沟道MOS管性能的非对称内表面氧化层结构。该结构是在MOS管的源端附近生长一层厚的内表面氧化层,以抑制载流子迁移率的降低,同时,在MOS管的漏端附近生长一层薄的内表面氧化层,以抑制器件的短沟道效应。使用TCAD软件进行仿真和分析,结果显示,与对称内表面氧化层结构相比,非对称内表面氧化层结构具有更好的导通-关断特性。对器件进行优化,当源端较厚的内表面氧化层占总氧化层的比例为15%左右时,器件的性能得到最大幅度的提高。在相同的关断电流下,与对称内表面氧化层器件相比,非对称内表面氧化层器件的导通电流提高5%~15%。 相似文献
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报道了多晶硅栅 6 H- Si C MOS场效应器件的制造工艺和器件性能。 6 H- Si C氧化层的SIMS分析说明在氧化过程中 ,多余的 C以 CO的形式释放 ,铝元素逸出极少 ,氧化层中因有较多的铝而正电荷密度较大 ,Si C的氧化速率和掺杂类型关系不大。器件漏电流都有很好的饱和特性 ,最大跨导为 0 .36 m S/ mm ,沟道电子迁移率约为 14cm2 / V.s,但串联电阻效应明显。 相似文献
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为了研究器件参数对GeSi MOSFET器件性能的影响,本文在建立一个简单的GeSi MOSFET的器件模型的基础上,对GeSi MOSFET的纵向结构进行了系统的理论分析.确定了纵向结构的CAP层厚度、沟道层载流子面密度、DELTA掺杂浓度以及量子阱阱深之间的关系,得出了阈值电压与DELTA掺杂浓度、栅氧化层厚度及CAP层厚度之间的关系,还得出了栅压与沟道载流子面密度、栅氧化层厚度及CAP层厚度之间的关系.并且在此基础上得出了一些有意义的结果.为了更细致、精确地进行分析,我们分别对GeSi PMOSFET和GeSi NMOSFET在MEDICI上做了模拟. 相似文献
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Ming-Kwen Tsai Shih-Wei Tan Yen-Wei Wu Ying-Jay Yang Wen-Shiung Lour 《Electron Devices, IEEE Transactions on》2003,50(2):303-309
Heterojunction bipolar transistors (HBTs) having an Al/sub 0.45/Ga/sub 0.55/As-GaAs digital-graded superlattice (DGSL) emitter along with an InGaP sub-emitter are reported. The band diagram of the DGSL emitter is analyzed by using a transfer matrix method and the theoretical result is consistent with the experimental observation that the DGSL emitter smoothes out the potential spike at the emitter-base junction. Such passivated HBTs with a high Al-fraction passivation layer exhibit a small offset voltage of 50 mV, a turn-on voltage of 0.87 V, and a current gain of 385. The HBTs are examined by wet-oxidizing the exposed passivated region under various conditions. Experimental results reveal that the HBTs with an exposed high Al-fraction emitter are sensitive to the ambient air. However, with InGaP capped upon the high Al-fraction emitter, the HBTs exhibit better oxidation quality. The wet oxidation brings forth the most remarkable improvements for the InGaP-capped HBTs when the passivation layer is totally wet oxidized. Furthermore, some devices from the same chip have undergone nitrogen treatment for comparison. 相似文献
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Chen W.B. Su Y.K. Lin C.L. Wang H.C. Chen S.M. Su J.Y. Wu M.C. 《Electron Device Letters, IEEE》2003,24(10):619-621
A partially oxidized Al/sub 0.98/Ga/sub 0.02/As layer was introduced between the emitter and base of collector-up heterojunction bipolar transistors (C-up HBTs) to suppress the leakage current and improve the current gain. Dependence of device current gain and leakage current on oxidation temperature was investigated. At lower oxidation temperature, the current gain can be effectively improved. Current gain and base sheet resistance were 79 and 203 ohm/sq. for the C-up HBT oxidized at 400/spl deg/C. 相似文献
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利用 Nomarski光学显微镜和 Raman光谱仪对分子束外延生长的 Al As层热氧化进行了系统的研究。对未氧化 ,氧化及氧化加原位退火的样品分析表明 ,目前氧化热稳定性差的主要因素是随氧化进行而产生的可挥发性产物如 As、As2 O3在氧化层中的残留量。在此分析的基础上 ,优化了氧化条件 ,使 Al As氧化的热稳定性有了质的提高 ,可以经受较高温度的退火 ,并消除了氧化层与两边 Ga As层之间的崩裂现象 相似文献
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《Materials Science in Semiconductor Processing》2002,5(1):1-4
A novel gate structure is proposed with oxidized sidewall and Ti polycide on top for application in RF LDMOS devices. The fabrication process of the Ti polycide was reported in connection with the gate length and dry etch conditions of SiN covered on poly gate. The gate length dependence of the Ti polycide process was confirmed, and the oxidized sidewall further reduced the effective gate length by 0.2 μm, depending upon the oxidation conditions. The application of the Ti polycide process in the RF LDMOS devices has improved device performance with higher cutoff frequency and higher RF amplification gain. 相似文献
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Grabherr M. Jager R. Michalzik R. Weigl B. Reiner G. Ebeling K.J. 《Photonics Technology Letters, IEEE》1997,9(10):1304-1306
Single- and multimode vertical-cavity surface-emitting lasers (VCSELs) with three unstrained GaAs quantum wells (QWs) and emission wavelengths around 850 nm have been fabricated using molecular beam epitaxy (MBE) for crystal growth. Wet chemical etching and subsequent selective oxidation are applied for current confinement. The influence of oxide layer position on lateral index guiding is studied in detail in order to increase maximum single-mode output power. A device of 3-μm active diameter and reduced index guiding shows maximum single-mode output power of 2.25 mW with a side-mode suppression ratio (SMSR) of more than 30 dB for high-efficiency oxidized VCSELs 相似文献
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《Solid-State Circuits, IEEE Journal of》1978,13(4):472-478
An O-POS (oxygen-doped polysilicon) film, deposited directly on silicon, is oxidized locally to create an active gate area. The electrical properties for the active gate area are the same as conventional p- and n-channel MOS devices, but the field area has an extremely high threshold voltage for both p- and n-type silicon substrates. The electrical properties in metal/oxidized O-POS/silicon and metal/oxide/O-POS/silicon structures have been investigated while varying the O-POS film thickness, oxygen concentration, local oxidation time, and silicon substrate resistivity. According to these basic studies, it is proposed that the high density of trapping centers existing in O-POS film is responsible for the high field threshold voltage. A applications of this process technology, a silicon-gate CMOS integrated circuit, and a high voltage n-channel MOS device are discussed. 相似文献
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本文研究了不同氧化处理下氮化铝陶瓷的氧化情况,并使用Mo-Mn法进行金属化,测试封接强度及气密性,从而探究氮化铝瓷的氧化机制,氮化铝基瓷与氧化层之间的结合。结果表明:经过1100℃/1h高温氧化处理,氮化铝陶瓷表面几乎没有氧化。在1250℃/1h、1250℃/2h,表面生成了氧化铝,氧化层主晶相为AlN与Al2O3;在1350℃/1h下,氧化层主晶相为Al2O3;氧化层表面有明显的裂纹,均漏气。对不同处理后的氧化铝层表面进行Mo-Mn法金属化,当氧化层厚度较薄时,断裂发生在氧化层。氮化铝瓷与氧化铝层之间的结合机理可能是在两者之间产生了AlON等中间物,从而实现了氮化铝瓷与氧化层之间牢固的连接。 相似文献
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Sjolund O. Louderback D.A. Hegblom E.R. Ko J. Coldren L.A. 《Quantum Electronics, IEEE Journal of》1999,35(7):1015-1023
We present theoretical and experimental results on monolithically integrated through-the-substrate input/output vertical-cavity lasers (VCLs) and resonant photodetectors that are compatible with substrate-side micro optics and flip-chip bonding. The required difference in bottom mirror reflectivity between the VCL and the detector is achieved by selective oxidation of a few high Al-content AlGaAs layers in the bottom mirror for the VCL. The modeling shows that using this approach makes it possible to individually design VCLs and resonant detectors from the same epitaxial structure without compromising performance of either device. Furthermore, since the oxidized layers are placed far enough from the active region, the VCL design is very robust with respect to uncertainties in the oxidized layers. For the detectors, we expect about 60% quantum efficiency, a 6-nm full-width at half-maximum optical bandwidth, and less than 1 nm difference in operating wavelength from the VCLs. Experimentally, VCLs and adjacent detectors with integrated microlenses have a difference of less than 0.5 nm in operating wavelength. The detectors have responsivities of 0.48 A/W, corresponding to 60% quantum efficiency and 7-nm optical bandwidths. Single-mode VCL's exhibit threshold currents as low as 135 μA while maintaining differential efficiencies above 50%. Larger multimode VCLs have differential efficiencies exceeding 70% with threshold currents of 0.5 mA 相似文献